Technical Program Manager (MCL)
On-site
Taipei, Taiwan
full time
Preferred
- Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
- Prior experience in electronic packaging industry and/or chip design industry
- Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
- Highly analytical and strategic thinker with quality and reliability of product in mind
- Skilled in DFx (x = manufacturability, reliability, and/or test)
- Comfortable in operating with ambiguity in fast‑evolving technology markets
- Excellent communication skills in English; Mandarin proficiency strongly preferred
Source: the employer's careers page. Last checked 2026-10-09. Posted 2026-10-08.
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