Solution Architect

Job Summary

The Chip Lead at HCLTech will drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities.

Key Responsibilities

Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up)

Act as primary technical interface to customers, driving trust, reviews, and escalations

Lead cross-functional teams across:

RTL Design

Verification (UVM-based)

Physical Design (PnR, STA, Signoff)

DFT and integration

Drive program planning, estimation, and execution in a services environment

Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets

Manage risk, dependencies, and change requests in dynamic customer programs

Skill Requirements

Proven experience leading customer-facing chip programs

Strong knowledge of:

SoC architecture and integration

RTL to GDSII full flow

Verification methodologies (UVM)

Physical design and signoff

Experience in multiple successful tapeouts

Strong stakeholder management (customer + internal)

Ability to lead distributed/global teams (onsite–offshore)

Preferred Qualifications:

Experience working in semiconductor services companies (e.g., large SI/ES firms)

Exposure to advanced nodes (≤7nm)

Experience with IPs (CPU subsystems, high-speed interfaces, AI/ML accelerators)

Familiarity with foundry interactions and tapeout processes

Business & Leadership Expectations:

Drive account growth (identify new opportunities within existing customers)

Balance delivery excellence + margin awareness

Mentor next-level leaders (Module Leads, Project Leads)

Bring execution rigor with customer-centric mindset

Strong communication for CXO-level interactions

Success Metrics:

On-time, first-time-right tapeouts

Customer satisfaction and repeat business

Program margin and efficiency

Team retention and capability growth

Other Requirements

Support pre-sales and solutioning:

Enable scaling of teams (onsite-offshore model) and optimize utilization

Lead tapeout readiness reviews and post-silicon debug coordination